Semiconductor vacuum oven

This machine is specialized for semiconductor power devices, IGBT and other high-power modules, products that require high-temperature soldering.

Add：Room A205, No.58, 2nd Industrial Park, Houting, Shajing 518104, Bao’an District, Shenzhen, China.

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◉ PRODUCT SPECIFICATION

Basic parameters
Models	HTC-612D	HTC-613D
Dimension (mm)	L6300W1450H1560	L6300W1450H1560
Weight	APPROX.: 3000KG	APPROX.: 3100KG
Number of heating zones	Top 6/ bottom 6	Top 6/ bottom 6
Number of cooling zones	Top 2/ bottom 2	Top 3/ bottom 3
Cooling method	Forced ice cooling	Forced ice cooling
Exhaust requirements	10m3 /H*2	10m3 /H*2
Void rate	APPROX.: 1%-2%	APPROX.: 1%-2%
Control system
Power requirements	3P 380V 50/60Hz	3P 380V 50/60Hz
Total power	60KW	64KW
Segmented starting power	35KW	35KW
Power consumption	APPROX.: 12KW-18KW	APPROX.: 13KW-18KW
Hot air blower speed regulation	Inverter stepless speed regulation	Inverter stepless speed regulation
Heating time	APPROX.: 30min	APPROX.: 30min
Temperature control range	Room temperature ~ 400°C can be set	Room temperature ~ 400°C can be set
Production recipes	Multi-combination production recipes can be stored	Multi-combination production recipes can be stored
Transportation
Number of lanes	Single lane	Single lane
Rail structure	3-segment combined structure	3-segment combined structure
Pallet dimension (mm)	L330*W250	L330*W330
Conveyor height (mm)	900±20	900±20
Mode of conveying	Isometric board-pushing	Isometric board-pushing
Vacuum system
Minimum vacuum pressure	0.1Kpa	0.1Kpa
Vacuum pump flow	APPROX.: 1000L/min	APPROX.: 1000L/min
Pressure relief time	≤10s	≤10s
Production efficiency	≥40s	≥40s
Nitrogen system
Nitrogen structure	Full/partial nitrogen filling	Full/partial nitrogen filling
Nitrogen system	Automatic	Automatic
Nitrogen consumption	APPROX.: 300-500L/min	APPROX.: 300-500L/min

◉ PRODUCTION AND WAREHOUSING

◉ MESSAGE

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