Vacuum reflow oven is an SMT soldering equipment equipped with vacuum chamber based on conventional nitrogen reflow system. While solder is molten, the chamber evacuates rapidly to remove bubbles inside solder joints, then backfills protective gas for cooling. It greatly reduces void rate for high‑reliability soldering.

Origin:

Traditional reflow oven creates voids in solder joints for power components, causing poor thermal performance and reliability risks.

Vacuum reflow oven was first researched in aerospace & military in the 1970s. In the 1990s, German manufacturers integrated vacuum chambers into inline reflow systems for mass production. After 2015, driven by EV power modules, domestic vacuum reflow ovens developed rapidly.

**Core principle**: Pull vacuum while solder is molten to extract bubbles and minimize voids.

Applications:

- EV power electronics: IGBT / SiC power modules, motor controllers

- Aerospace & defense electronics

- Semiconductor power device packaging

- Energy storage & railway power units

- Optical modules, high‑power LED, high‑reliability medical electronics